... giving the process engineering department an opportunity to evaluate the process traveler and artwork, the planner will not only have a better understanding of | WIRING BOARDS | the process, but the process engineering department will have the opportunity to make changes prior to the release of the product to production. Items to | WIRING BOARDS | consider before the process traveler is generated: * Material availability. * Shrinkage compensation. * Drill registration tolerance. * Drill size availability. * Etching compensations. * | WIRING BOARDS | Plating compensations. * Routing compensations. * Testing capabilities. * Time studies (provided by process engineering). * Daily capacity of the plant (provided by production control). | WIRING BOARDS | LAMINATE MATERIAL PERFORMANCE Many manufacturing facilities have multiple laminate vendors, which in turn have materials with different characteristics. For example, the internal layer stretch compensation | WIRING BOARDS | for one vendor's laminates may differ greatly from that of another's. Most vendors provide this ...
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... it should take place in multiple processes. * Organization of any special tools (drill or router bits, for example) for "out of the ordinary" | WIRING BOARDS | processes. * Material availability, either in-house or on order (and the latter's delivery schedule). * UL capability. Tip: Have a pre-order check, or educate the | WIRING BOARDS | sales team about facility capabilities. The planner must know the manufacturing facility and its capabilities. By giving the process engineering department an opportunity to evaluate | WIRING BOARDS | the process traveler and artwork, the planner will not only have a better understanding of the process, but the process engineering department will have the | WIRING BOARDS | opportunity to make changes prior to the release of the product to production. Items to consider before the process traveler is generated: * Material availability. | WIRING BOARDS | * Shrinkage compensation. * Drill registration tolerance. * Drill size availability. * Etching compensations. * Plating compensations. * Routing compensations. * Testing ...
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... and desired hole diameter. Figure 3 is a synopsis of hole manufacturing technology capabilities. The most established microvia technology, mechanical drilling, has existed since | WIRING BOARDS | the first generation of | SINGLE-SIDED PCBS |, and it has proved surprisingly adaptable as via sizes decrease, densities increase, and the complexity of multilayer | WIRING BOARDS | boards (MLBs) escalates. Automated mechanical drilling systems equipped with multiple spindles, control-depth positioning, and high-velocity positioning tables can process several panels simultaneously to achieve higher | WIRING BOARDS | throughput and lower processing costs. Mechanical drilling is an effective method for hole diameters larger than 0.010" (250 microns). Below 0.010", however, operational costs rise | WIRING BOARDS | exponentially. For example, a manufacturer might get 5,000 hits per drill bit when forming 0.008" or 0.010" vias but only 1,000 hits per bit for | WIRING BOARDS | 0.006" vias. However, recent advances in mechanical drilling technology such as high-speed spindles (Figure ...
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