... 0.006 250 0.010 17 0.65 DS 50.8 2000 288 20 130 V-0 All + SS-Single sided, DS-Double or single sided Marking Company name, "MIC" | WIRING BOARD | or trademark and type designation may be followed by suffix to denote factory indentification or buring test classification. See General Information Preceeding These Recognitions A | WIRING BOARD | (black triangle ) Symbol is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level require-ments | WIRING BOARD | of UL 796. "All" is used to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level | WIRING BOARD | requirements of UL 796. For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. Explanations concerning the UL | WIRING BOARD | certification Clad Cond Width Min The minimum conductor width is 150 µm, except the distance of the track to the outer contour is smaller than | WIRING BOARD | 400 µm. Clad Cond Width Min Edge If ...
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... solder areas must be clear of component print for at least 250µ or imperfect print and printed solder areas may result. | 10. NON-PLATED | WIRING BOARD | HOLES | PRINTED CIRCUIT BOARDS | 10.1 This refers to plated through PCBs: If we do not have any information from you as to which | WIRING BOARD | holes are to be plated-through and which are not, we will determine this to the best of our knowledge. 10.2 If non-plated holes are positioned | WIRING BOARD | in a pad, this pad must be bigger than the hole by at least factor 1.5. Otherwise some or all of the pads may be | WIRING BOARD | removed. | 11. DATA PROVIDED (DATA INCONSISTENCY) | 11.1 If drilling and measurement plans are included that do not match the drilling program or the | WIRING BOARD | contour according to the gerber-data, then the drilling program and the gerber-data will be binding in all cases. | 12. PCB CONTOUR | 12.1 If | WIRING BOARD | not otherwise stipulated, the PCB contour will be determined by the centre (=centre vector) of the contour lines provided in the order data. If Slots | WIRING BOARD | are represented by you ...
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... the material through photothermal ablation. UV lasers remove material through a process called photochemical ablation, in which the higher-energy UV photons literally sever the | WIRING BOARD | chemical bonds of the absorbing material. Photochemical ablation forms cleaner microvias, while photothermal ablation creates more debris in and around the microvia that must be | WIRING BOARD | removed. However, the debris is non-tenacious and is easily removed by conventional cleaning techniques such as permangate desmear. Regardless of the ablation mechanism, high peak | WIRING BOARD | powers and short laser pulses give the best microvia results. Each material has a unique ablation threshold, above which vaporization occurs for a given wavelength | WIRING BOARD | and laser fluence (energy/area). | MOST LASER-BASED SYSTEMS | are typically configured for direct microvia formation, which means that each microvia is drilled one at | WIRING BOARD | a time at high speed. With this technique, the size of the focused laser beam usually defines the size of the microvia or the ...
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