| Not only is the chemical silver refinement uncomplicated and reliable, but once the manufacturing parameters have been set they can be dependably utilised for further processing and continued use.
Due to the thin surface layer – a thickness of 0.15 – 0.3 mµ is recommended – the surface of the pad is smoother and therefore there are, even in fine pitch areas, no restrictions when assembling. The silver functions merely as a protection against oxidation, and the actual solder point is between the copper and chemical tin, therefore the solder point is absolutely stable. It fulfills all UL requirements (UL796 specif.) and meets the usual requirements of automobile manufacturers: