... The dual-laser technique illustrates the versatility of CO2 and UV DPSS lasers for high-volume microvia formation over a broad range of materials and operating | PRINTED WIRING BOARDS PRODUCER | conditions. In fact, their adaptability has helped to establish these two laser types as industry workhorses in applications from prototyping to full production runs. For | PRINTED WIRING BOARDS PRODUCER | manufacturers, the key to cost-effective, high-volume microvia formation lies in understanding the unique capabilities of these two lasers (Table). Comparison of Laser Capabilities Laser Type | PRINTED WIRING BOARDS PRODUCER | UV DPSS RF CO2 Compatible Dielectric Types FR-4, RCF, Polyimide, PTFE, Aramid FR-4, RCF, Polyimide, PTFE, Aramid Microvia Diameter in Production 25 mm to 150 | PRINTED WIRING BOARDS PRODUCER | mm 80 mm to 250 mm Typical Drilling Speed 30-mm diameter via at 100 holes per second (copper + dielectric) 100-mm diameter via at 450 | PRINTED WIRING BOARDS PRODUCER | holes per second (dielectric only), 170 holes per second (copper + dielectric) Direct Copper Drilling Speed 30-mm diameter via at 100 holes per second 100-mm | PRINTED WIRING BOARDS PRODUCER | diameter via at 200 ...
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... ave Dieameter down to a minimum of 0,1 mm. Threfore both partial and through-vias can be conventionally drilled. | MICROSECTIONING | The preparation of | PRINTED WIRING BOARDS PRODUCER | a specimen for the microscopic examination of the material to be examined, usually by cutting out a cross-section followed by encapsulation, polishing, etching, staining, etc. | PRINTED WIRING BOARDS PRODUCER | | MID | (3-D) 3-dimensional molded interconnect devices | MINIMUM ANNULAR RING | The minimum width of metal, at the narrowest point, between the edge | PRINTED WIRING BOARDS PRODUCER | of the hole and the outer edge of the terminal area. This measurement is made to the drilled hole on internal layers of multilayer printed | PRINTED WIRING BOARDS PRODUCER | boards and to the edge of the plating on outside layers of multilayer boards and double sided boards. | MINIMUM ELECTRICAL | Spacing The minimum | PRINTED WIRING BOARDS PRODUCER | allowable distance between adjacent conductors that is sufficient to prevent dielectric breakdown or corona or both, between the conductors at any given voltage and altitude. | PRINTED WIRING BOARDS PRODUCER | | MINIMUM PLATED-THROUGH HOLE | Size A hole size equal ...
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... | Next up are the internal plane layers. For some reason, CAD engineers like them to be "positive," but those types of layers lead | PRINTED WIRING BOARDS PRODUCER | to huge file sizes. Negative plane layers are usually preferred by fabricators because they're easier to work with and have smaller file sizes than positive | PRINTED WIRING BOARDS PRODUCER | layers. Remember, boards are manufactured en masse and must be stepped out into a panelized form. The result: Data sets with lots of unnecessary positive | PRINTED WIRING BOARDS PRODUCER | planes swell exponentially, bog down CAM systems, and crash photoplotters. After the basic prep work is completed, step into the fabrication | PRINTED CIRCUIT BOARDS | PRINTED WIRING BOARDS PRODUCER | | analysis arena, where the game is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and balances can resolve | PRINTED WIRING BOARDS PRODUCER | any conflicts between the two. | TAKE SOLDERMASK LAYERS |, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that is, | PRINTED WIRING BOARDS PRODUCER | there is not much in the way of capability checking within the tool. As a result, ...
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