Printed Circuit Boards Technologies Printed Circuit Boards with Buried Vias | Blind Vias | Embedded Passive Components | Impedance Control.

... OF PRINTED CIRCUIT BOARDS | | REFLOWING | The melting of an electrodeposit followed by solidification. The surface has the appearance and physical characteristics | PRINTED CIRCUIT BOARDS TECHNOLOGIES | of being hot dipped. | REGISTRATION | The degree of conformity of the position of a pattern, or a portion thereof, with its intended position | PRINTED CIRCUIT BOARDS TECHNOLOGIES | or with that of any other conductor layer of a board. | RESIN EPOXY-MATERIAL | used for impregnating glass weave. | RESIN | Recession The | PRINTED CIRCUIT BOARDS TECHNOLOGIES | presence of voids between the barrel of the plated-through hole and the wall of the hole, seen in microsections of plated-through holes in boards exposed | PRINTED CIRCUIT BOARDS TECHNOLOGIES | to high temperatures. | RESIN SMEAR | Resin transferred from the base material onto the surface or edge of the conductive pattern normally caused by | PRINTED CIRCUIT BOARDS TECHNOLOGIES | drilling. Sometimes called Epoxy Smear. | RESIST COATING MATERIAL | used to mask or to protect selected areas of a pattern from the action of | PRINTED CIRCUIT BOARDS TECHNOLOGIES | an etchant solder, or plating. | RING VOIDS | The absence of substance in a localized area, as an ...
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... Multilayer Boards A BRIEF DESRICPTION OF THE PROBLEM: PCB`s, especially Multilayer boards are extremly sensitive towards moisture The microscopic structure of the Multilayer material | PRINTED CIRCUIT BOARDS TECHNOLOGIES | develops a strong capillary power that soaks up the humidity of the surrounding air. Even under very dry conditions it is a question of time | PRINTED CIRCUIT BOARDS TECHNOLOGIES | that water accumulates in the stored PCB`s. For example: At storage conditions of 20 C° and 35 % of humidity the weight of the epoxyraisin | PRINTED CIRCUIT BOARDS TECHNOLOGIES | of the Multilayer PCB`s rises 0,12 % due to the accumulation of moisture. If the capillary effect leads to an increase of more than 0,17 | PRINTED CIRCUIT BOARDS TECHNOLOGIES | % a gas pressure of 8-10 bar can be reached, causing delamination Even if delamination tests are made after production, the danger of delamination can | PRINTED CIRCUIT BOARDS TECHNOLOGIES | rise again due to unsafe transportation and long storage times. Therefore we would like to give you following proposals to avoid the described problems: B | PRINTED CIRCUIT BOARDS TECHNOLOGIES | STORAGE CONDITIONS PCB`s should be stored in heated and dry rooms. Constant low humidity ...
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... does not occur. Should there be soldering problems due to processing errors, “de-wetting” or other faulty soldering points can be seen immediately, thanks to | PRINTED CIRCUIT BOARDS TECHNOLOGIES | clear demarcation to the copper. However, the most important argument in favour of OSP is its price: in contrast to other lead-free alternatives with their | PRINTED CIRCUIT BOARDS TECHNOLOGIES | complicated electrolytic or chemical procedures, OSP is basically just a one-step process. Chemical tin, chemical silver and chemical nickel-gold are therefore, far more expensive; HAL | PRINTED CIRCUIT BOARDS TECHNOLOGIES | only marginally so. Doubts - just a European attitude? So, what are the disadvantages ? European users, in particular, can list quite a few: the | PRINTED CIRCUIT BOARDS TECHNOLOGIES | predominant one being, that for mixed components and other multi-thermic processes, the organic protection layer breaks off at temperatures above 150° C . All in | PRINTED CIRCUIT BOARDS TECHNOLOGIES | all, the area of use for soldering at higher melting temperatures has not yet been reliably tested. In addition, OSP does not bond. The ability | PRINTED CIRCUIT BOARDS TECHNOLOGIES | to bond with soldering paste – in particular ...
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