... of fabricating a printed wiring board which results in the final metallization being copper with no other protective metal but the non soldered areas | PRINTED CIRCUIT BOARDS SERVICES | are coated by a solder resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing | PRINTED CIRCUIT BOARDS SERVICES | them to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a | PRINTED CIRCUIT BOARDS SERVICES | liquid (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 | PRINTED CIRCUIT BOARDS SERVICES | F liquid to cool it and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and | PRINTED CIRCUIT BOARDS SERVICES | surface insulate those areas of a circuit where soldering is not desired. | STEP AND REPEAT | A method by which successive exposures of a | PRINTED CIRCUIT BOARDS SERVICES | single image are made to produce a Multiple Image Production Master. | SUB-PANEL | A group of printed circuits (called modules) arrayed in a panel ...
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... of the inner-layer alignment is still the greatest quality risk in the production of multi-layers. Until now, in order to maintain an acceptable reject | PRINTED CIRCUIT BOARDS SERVICES | rate, many extremely machine-intensive work steps have been necessary (e.g. the use of x-ray machines). Thanks to a revolutionary technique developed In cooperation with the | PRINTED CIRCUIT BOARDS SERVICES | Lenz Company and the Frauenhofer Institute, for which a patent has been applied, we have managed to eliminate the quality pifalls as well as to | PRINTED CIRCUIT BOARDS SERVICES | combine all of the work steps, from stock recognition to CNC drilling into one step. The advantages for cost and competiveness are immense ! The | PRINTED CIRCUIT BOARDS SERVICES | Problem Multi-layer pressing can only guarantee the best innerlayer adhesion if the fibre glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as | PRINTED CIRCUIT BOARDS SERVICES | a dielektric medium, gel. As a result of the high pressures (150 bar) and temperatures (175 C) applied the resin becomes so fluid that the inner-layers | PRINTED CIRCUIT BOARDS SERVICES | actually swim and expand due to the heat. This ...
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... problem has yet to be resolved. The chemical nickel-gold procedure (Imm NiAu) was unsuccessful due to high costs, as was chemical tin. Both procedures | PRINTED CIRCUIT BOARDS SERVICES | have proven to be very complicated and sensitive in the further course of processing management. Lead-free solderings also have serious disadvantages, as hot air tin | PRINTED CIRCUIT BOARDS SERVICES | surfacing exposes the multi-layers to higher processing temperatures and copper leaching effects. We would briefly like to explain why we believe chemical silver is the | PRINTED CIRCUIT BOARDS SERVICES | lead-free procedure of the future, and why it will be the focus of our future investments in the field of surface refinement: UNPROBLEMATIC WASTE WATER | PRINTED CIRCUIT BOARDS SERVICES | PROCESSING Similarly to chemical tin surfacing, it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of copper and the more “precious” silver. The | PRINTED CIRCUIT BOARDS SERVICES | advantages of this processing manner compared with chemical tin are fewer processing steps and lower rinsing temperatures (30 – 50 C°). From the printed circuit ...
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