... of 274X. Include IPC-D-356 netlist data Check spacing Identify potential drill problems. Validate soldermask layers. First off, make sure layers are properly aligned and | PRINTED CIRCUIT BOARD | ordered correctly. File names should be meaningful, correlated with the layers, and explained to the fabricator in a | README FILE |. The idea here | PRINTED CIRCUIT BOARD | is that the fabricator should be able to quickly understand what each file is and where it goes in the stackup. If you wish to | PRINTED CIRCUIT BOARD | continue using Gerber data | PRINTED CIRCUIT BOARDS | , switch to 274X. 274D is obsolete; the external aperture information is more cumbersome and difficult | PRINTED CIRCUIT BOARD | for fabricators to deal with because they have to worry about translators and parsers to read the aperture table information. As a result, aperture data | PRINTED CIRCUIT BOARD | might be misinterpreted. Worse, someone might have typed in the information manually - and erroneously. By contrast, in 274X, all the aperture information is contained | PRINTED CIRCUIT BOARD | within the Gerber file, which can be read by most CAM tools ...
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... the same data, such as the surface mount component's length and width. The operator must determine whether the aperture wheel calls out X first | PRINTED CIRCUIT BOARD | and Y second or Y first and X second. The wrong choice may cause the surface mount land to short into another feature or become | PRINTED CIRCUIT BOARD | oversized or undersized. A mistype of a circle instead of a square may deprive the SM component of a land that is sufficient to ensure | PRINTED CIRCUIT BOARD | the component is level during wave soldering. When typed incorrectly, soldermask clearance sizes can result in mask on lands or enlarged clearances that expose traces. | PRINTED CIRCUIT BOARD | Open Road: When asking a fabricator to manually manipulate the aperture wheel, the final part design is left to the front-end operator. When a designer | PRINTED CIRCUIT BOARD | doesn't have the option to export files using 274X, it is always helpful to provide the plotted artwork to the manufacturer for verification. 274X provides | PRINTED CIRCUIT BOARD | a quick and efficient means of importing data with no need for operator interpretation. The data provided are ...
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... hole. | 7. PAD | PRINTED CIRCUIT BOARDS | 7.1 If non-plated holes are positioned on one pad, the pad must have a surround | PRINTED CIRCUIT BOARD | of at least 500µ larger than the hole. Otherwise some/all of the pads may be removed. | 8. SOLDER RESISTS | 8.1 Please refrain from | PRINTED CIRCUIT BOARD | oversizing when drafting solder resists, i.e. the solder stop spaces are 1:1 to the pads. This facilitates the incorporation and required stretching of the solder | PRINTED CIRCUIT BOARD | resists during the manufacturing process. | 9. SILKSCREEN | 9.1 In order to perfectly reproduce silkscreens, the type must be at least 1mm high and | PRINTED CIRCUIT BOARD | the stroke at least 200µ thick. Also, all surrounding solder areas must be clear of component print for at least 250µ or imperfect print and | PRINTED CIRCUIT BOARD | printed solder areas may result. | 10. NON-PLATED HOLES | PRINTED CIRCUIT BOARDS | 10.1 This refers to plated through PCBs: If we do not | PRINTED CIRCUIT BOARD | have any information from you as to which holes are to be plated-through and which are not, we will determine this to the best of | PRINTED CIRCUIT BOARD | our knowledge. 10.2 If ...
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