... the assembling process of the PCBs is started immediatedly afterwards. The time after drying should not exceed 48 hours not to rise the risk | PCB TECHNOLOGIES | of delamination again. | FORMING MICROVIAS |. (Demand for small holes is ramping, with CO2 lasers leading the way) Thanks largely to the proliferation of | PCB TECHNOLOGIES | smaller, more complex electronics devices such as cell phones, personal digital assistants, and notebook computers, the PCB industry is experiencing an overwhelming rise in demand | PCB TECHNOLOGIES | for high-density interconnect structures (HDIS). The demand for HDIS translates directly into a vigorous market for the microvias used in many of these multilayer substrates | PCB TECHNOLOGIES | as well as in conventional PCBs. In 1998, for example, the worldwide microvia market made up about four percent of the total multilayer PCB market. | PCB TECHNOLOGIES | By 2007 that market share is expected to expand to nearly 30 percent (Figure 1). Figure 1. Estimates predict | MICROVIA BOARDS | will comprise | PCB TECHNOLOGIES | 29 percent of all buildup boards by 2007. Worldwide, the ...
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... support of our PCB- Team. The calculation of the price is based accurately on the technical profile of the individual PCB; there are no | PCB TECHNOLOGIES | cross-subsidy and no lump sums. You pay only for the achievement, which must be actually furnished for the production of your product. Our proven mass-production-express | PCB TECHNOLOGIES | service (Rapid-Mass-Production) is offered also in this line | SELECTED CAPABILITIES: | Archiving Process Data Drill- / Milling Program Archiving Customer Data Production Data Conversion | PCB TECHNOLOGIES | E-Test optional Design Check UL - approval Design Adjustment Further Options | TECHNICAL SPECIFICATION: DELIVERY: | In Single Board Format as well as in Panelized | PCB TECHNOLOGIES | Board Arrays and Sub-Arrays with / without Fixing Tabs finished by Milling, Punching and Scoring to size. | DATA-BASE FORMAT: | Gerber, ODB++, DPF Type | PCB TECHNOLOGIES | of the Base Material: FR 4 and Special-Material Layers: Up to 24 Surface Protection: See List of Surfaces [- ?-] Layer Build-Up: Arbitrary Electrical Testing: | PCB TECHNOLOGIES | Flying Probe or ...
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... and cost. Two systems are particularly predominant: tin/silver/copper (SnAgCu) and, more recently, stabilised tin/copper (SnCuNi). Although the level of efficiency of both systems is | PCB TECHNOLOGIES | not yet completely clear, the following presents the latest information: SnAgCu There is more experience in the field of silver systems. Here, differentiation is made | PCB TECHNOLOGIES | between the Sn-3.5Ag-0.7Cu, Sn-4Ag-0.5Cu and Sn-3Ag- 0.5Cu systems which vary in use from continent to continent. However, the agreed expert opinion (IPC/Soldertech-Conference Brussels 2003) is | PCB TECHNOLOGIES | that the technological differences between the three systems are negligible. Sn-3.5Ag-0.7Cu is the most common alloy in Europe. SnCuNi Although there are even fewer field | PCB TECHNOLOGIES | results for the stabilised tin/copper system Sn-0.7Cu- 0.1Ni, it shows a lot of potential. It is called “stabilised” because the addition of nickel is said | PCB TECHNOLOGIES | to show an improved hardening reaction in soldering. The creation of needle-structured crystals is said to alter to rounder ...
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