... of optimal testing is repeatedly posed in the production process. The Dilemma is obvious: The days of the first “printed circuits” which could be | PCB SERVICES | checked simply with the naked eye are over. Today, high-tech equipment is necessary for a thorough PCB test. Optical checks with the aid of conventional | PCB SERVICES | micro-scopic equipment are sufficient for one sided and relatively simple double-sided PCBs. Residues, constricted conductors and subcorrosions can be discovered which would otherwise lead to | PCB SERVICES | PCB failure after a number of operational hours. An electrical test is needed to check the actual functions of a PCB. It is an essential | PCB SERVICES | if inner layers need to be tested, as is the case with multi-layers. In two position measure-ments all connections in the PCB are checked for | PCB SERVICES | stoppages and short circuits. All SMD pads and plated through holes are checked. The electrical test can be conducted as a parallel or finger test. | PCB SERVICES | Parallel test: For the parallel test a control adaptor is constructed, ...
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... to hydrogen in the 90° C nickel baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, in | PCB SERVICES | turn, also calls for further investment in facilities. THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel | PCB SERVICES | gold coating, the results of wave soldering are equally good to solder levelling. Good storage ability is also achieved by covering the pad and smd | PCB SERVICES | sides with gold. In our opinion, however, immersion nickel / gold will never become an established alternative to HAL. As already mentioned, the processing costs | PCB SERVICES | are the greatest handicap for this method. However, due to the lack of other alternatives in the lead-free future immersion nickel / gold will retain | PCB SERVICES | its position in the area of fine pitch and COB applications. Cost disadvantages of the immersion nickel / gold process could be balanced, in particular | PCB SERVICES | in the production of large series (consumer goods), if the use ...
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... BOARDS | | HOLE BREAKOUT | A condition in which a hole is not completely surrounded by the land. | HOLE DENSITY | The | PCB SERVICES | quantity of holes in a printed board per unit area. | HOLE LOCATION | - The dimensional location of the center of a hole. | | PCB SERVICES | HOLE PATTERN | The arrangement of all holes in a printed board. | HOLE PREPARATION | The hole prior to plating shall be clean cut | PCB SERVICES | and free of burrs, loose or hanging fibers, copper dust and resin dust. | HOLE PULL STRENGTH | The force (in pounds) necessary to rupture | PCB SERVICES | a plated-through hole when loaded or pulled in the direction of the axis of the hole. | HOLE |Void A void in the metallic deposit | PCB SERVICES | of a plated-through ...
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