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... film using a hot roll laminator. Generally, 1.0 mil thick resist is used when the required plating thickness is 1 mil. Thicker resists (1.5 | PCB PROTOTYPING | mil or 2.0 mil) are used when large holes are to be tented to prevent plating in the holes. After dry film resist lamination, the | PCB PROTOTYPING | panels are automatically loaded on to an accumulator for the next operation. Expose Image The circuit image is transferred on the dry film resist by | PCB PROTOTYPING | placing a positive image film of the circuit directly on the resist and exposing it with UV light. We have two ORC Opti-Beams automatic exposure | PCB PROTOTYPING | systems. Panels are automatically fed into the autoexposure unit.  The panel is aligned to the top and bottom circuit films and a vacuum pump removes | PCB PROTOTYPING | the air between the panel and the film. Exposure is controlled by an integrator located near the panels.The imaging process is carried out in a | PCB PROTOTYPING | controlled environment to minimise the effects of temperature and humidity variation and maximise the yield of quality product. After ...
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... be supplied with each new job and should contain the following information to ensure that the finished board is to your requirements. - Always | PCB PROTOTYPING | required even when a drill file is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must | PCB PROTOTYPING | be clearly represented with distinct differences between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred | PCB PROTOTYPING | with | OVERALL MECHANICAL DIMENSIONS | including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not | PCB PROTOTYPING | required unless different to our standard of + / -0.25 mm. | OTHER INFORMATION REQUIRED FOR ALL BOARDS INCLUDES: | board thickness (standard = 1.6mm) | PCB PROTOTYPING | base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour (std = white) | PCB PROTOTYPING | bare board testing requirement (std for multilayer and ...
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... printed on or near any edge of a PCB and intended for mating with an edge connector. | ELECTROLESS DEPOSITION | The deposition of | PCB PROTOTYPING | conductive material from an autocatalytic plating solution without application of electrical current. | ELECTROPLATING | The electrodeposition of an adherent metal coating on a conductive | PCB PROTOTYPING | object for protection, decoration, or other purposes. The object to be plated is placed in an electrolyte and connected to one terminal of a DC | PCB PROTOTYPING | voltage source. The metal to be deposited is similarly immersed and connected to the other terminals. Ions of the metal provide transfer to metal as | PCB PROTOTYPING | they make up the current flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been deposited onto the edges of the conductive pattern | PCB PROTOTYPING | during drilling. Also called Resin Smear. | ETCH FACTOR | The ratio of the depth of etch (conductor thickness) to the amount of lateral etch | PCB PROTOTYPING | (undercut). | ETCHBACK | The controlled removal of all components of base material by a ...
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