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... of board. These marks could be the board reference so long as it cannot be read from the other side. (This is for your | PCB PRODUCTION | protection to prevent the boards made inside out). | IMAGES | should comply with design rules that will result in a board that will meet | PCB PRODUCTION | performance and cost requirements. - | SCALE MUST BE GIVEN, | tapes securely stuck to the backing sheet, track to pad & track to track | PCB PRODUCTION | joints complete and the backing sheet clean. - Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and | PCB PRODUCTION | traces dense enough for blocking light when photographing. - Preferred on 7mil (178mm) thick base for stability. Films should be plotted on laser photoplotter or | PCB PRODUCTION | on vector photoplotter using a minimum resolution of ½mil (13mm). - Preferred in Gerber® format although accepted in other formats. (Refer to CID- 014 for | PCB PRODUCTION | information on Documentation in Digital Form). - files are the only acceptable form of supplying images for multilayers and boards with fine (0.2mm ...
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... gas pressure of 8-10 bar can be reached, causing delamination Even if delamination tests are made after production, the danger of delamination can rise | PCB PRODUCTION | again due to unsafe transportation and long storage times. Therefore we would like to give you following proposals to avoid the described problems: B STORAGE | PCB PRODUCTION | CONDITIONS PCB`s should be stored in heated and dry rooms. Constant low humidity is necessary before the soldering processes start. A rapid fall in temperature | PCB PRODUCTION | of more than 7 degrees causes condensation on the stored PCB`s. Humidity should never exceed 65 %. The package must be kept intact although the | PCB PRODUCTION | polyethylene packages capability of keeping humidity away is not really reliable. C STORAGE TIME The storage time of PCB`s should be as short as possible. | PCB PRODUCTION | PCB`s should be taken out due to the „first-in, first out“ rule. The the polyethylene packages should be taken away just before the assembling. Remaining | PCB PRODUCTION | PCB`s should be repacked again. To avoid exposure to draught, the ...
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... sponsored by The procurement of PCBs often leads to the question as to which surface protection is the right one. This is partly due | PCB PRODUCTION | to the changing technical demands on PCBs in further processing. Also, as of 1. 6. 2006, EU-Regulations restricting the use of dangerous materials in electronic | PCB PRODUCTION | appliances are to include the prohibition of materials containing lead, and is, therefore, another reason why alternative surfaces have been developed. One of these is | PCB PRODUCTION | immersion tin. Procedure A layer of tin is applied to the PCB by means of a special process, in which the copper atoms of the | PCB PRODUCTION | exposed conductors and contact areas are exchanged for tin atoms by adding thiourea. The chemical reaction ends when the copper surface is 0,6 to 1,2 | PCB PRODUCTION | my. Between the tin and copper layers there is an inter-metallic copper-tin phase after this process, i.e. blended metal. There are a number of reasons | PCB PRODUCTION | in favour of applying tin chemically. One advantage is the uniform smoothness of the surface. This ...
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