... manufacturer. OSP is an organic solution based on an imidazole substitute which, by means of dipping or rinsing can be selectively applied to the | PCB PLANT | copper surfaces, ready for soldering. A transparent layer, max. 0.2 to 0.6 my thick, covers the copper like a barely visible clear varnish. COMPLETELY LEVEL | PCB PLANT | THANKS TO DIRECT CONTACT WITH THE COPPER Purely as a sealing agent, OSP offers good preconditions to adhere components that require an absolutely level surface, | PCB PLANT | thanks to the fact that the soldering paste is applied directly to the copper. The common problem of twisted fine-pitch components due to raised “tin | PCB PLANT | bubbles” on the HAL surface is, therefore, a thing of the past. The impress technique can be more precise with OSP, if one considers how | PCB PLANT | much firmer the copper is because of its direct contact with the component. The varnish forms an airtight cover to the copper surface and “allows” | PCB PLANT | the processed boards a storage life of 6 months maximum. Increasingly, after this time, the ...
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... without actually curing the material. Drying is done in an oven designed specially for this application. A single heater plenum and a unique baffle | PCB PLANT | system effectively removes the solvent from the liquid solder mask without starting the cross-linking action. Screened panels are manually loaded into the conveyorized oven as | PCB PLANT | they come off the screen printer. The dried panels are automatically loaded on to an accumulator for cool down and availability to the imaging operation. | PCB PLANT | Image LPI Mask Dried solder mask is imaged in a manner similar to that used for imaging the circuitry. Phototools containing black areas where the | PCB PLANT | solder mask is to be removed are placed in direct contact with both sides of the panel. The panel is then exposed to UV light. | PCB PLANT | The amount of light used is controlled by an integrator. Printing is done with a semi-automatic dual drawer printer. While one drawer is being loaded | PCB PLANT | with a panel and phototools, the other is inside the machine being exposed. This dual ...
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... meaning that the lead-free problem has yet to be resolved. The chemical nickel-gold procedure (Imm NiAu) was unsuccessful due to high costs, as was | PCB PLANT | chemical tin. Both procedures have proven to be very complicated and sensitive in the further course of processing management. Lead-free solderings also have serious disadvantages, | PCB PLANT | as hot air tin surfacing exposes the multi-layers to higher processing temperatures and copper leaching effects. would briefly like to explain why chemical silver is | PCB PLANT | the lead-free procedure of the future, and why it will be the focus of our future investments in the field of surface refinement: UNPROBLEMATIC WASTE | PCB PLANT | WATER PROCESSING Similarly to chemical tin surfacing, it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of copper and the more “precious” silver. | PCB PLANT | The advantages of this processing manner compared with chemical tin are fewer processing steps and lower rinsing temperatures (30 – 50 C°). From the ...
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