... SILVER = IMM AG) | Lead-Free PCB´s -The Surface of the Future ! Since July 1st, lead soldering is no longer permitted, and the | MULTILAYER CIRCUITS TECHNOLOGIES | use of alternative surface refinements for pcb´s has so far provided unsatisfactory results, meaning that the lead-free problem has yet to be resolved. The chemical | MULTILAYER CIRCUITS TECHNOLOGIES | nickel-gold procedure (Imm NiAu) was unsuccessful due to high costs, as was chemical tin. Both procedures have proven to be very complicated and sensitive in | MULTILAYER CIRCUITS TECHNOLOGIES | the further course of processing management. Lead-free solderings also have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher processing temperatures and | MULTILAYER CIRCUITS TECHNOLOGIES | copper leaching effects. We would briefly like to explain why we believe chemical silver is the lead-free procedure of the future, and why it will | MULTILAYER CIRCUITS TECHNOLOGIES | be the focus of our future investments in the field of surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, it is a | MULTILAYER CIRCUITS TECHNOLOGIES | non-electrical, auto-catalytic procedure based on ...
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... Can be supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard | MULTILAYER CIRCUITS TECHNOLOGIES | that will enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These | MULTILAYER CIRCUITS TECHNOLOGIES | marks could be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the | MULTILAYER CIRCUITS TECHNOLOGIES | boards made inside out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. - Scale | MULTILAYER CIRCUITS TECHNOLOGIES | must be given, tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. - | MULTILAYER CIRCUITS TECHNOLOGIES | Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light when photographing. | MULTILAYER CIRCUITS TECHNOLOGIES | - Preferred on 7mil (178mm) thick base for stability. Films should be plotted on laser photoplotter or on vector photoplotter using ...
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... or unsupported hole. | CONDUCTOR WIDTH |The observable width of the pertinent conductor at any point chosen at random on the printed board, normally | MULTILAYER CIRCUITS TECHNOLOGIES | viewed from vertically above unless otherwise specified. | CONFORMAL MASK SYSTEM | | CONTACT ANGLE | The contact angle is to be understood as the | MULTILAYER CIRCUITS TECHNOLOGIES | angle between the copper surface and the solidified solder. The lower the angle, the better has the flowing of the solder been. A good wetting | MULTILAYER CIRCUITS TECHNOLOGIES | (soldering) will show contact angles between 0° and 45°, whereas a poor wetting will show contact angles above 45°. | COPPER FOIL | A cathode-quality | MULTILAYER CIRCUITS TECHNOLOGIES | electrolytic copper deposition as a thin, continuous sheet on rotating drums direct from refinery electrolytes. Used as a conductor for printed circuits, copper foil readily | MULTILAYER CIRCUITS TECHNOLOGIES | bonds to insulating substrates, accepts the printed resists, and etches out to make printed circuits. It is made in a number of weights (thickness) the | MULTILAYER CIRCUITS TECHNOLOGIES | traditional weights are 1 to 3 ounces per square foot 0.0014 to 0.0042 inch ...
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