... level of quality at prices, being competitive worldwide. As the role of PCBs gets more and more crucial for the business success in times | MULTILAYER CIRCUITS MANUFACTURING | of shortening time to market cycles, our products offer more potential for saving money than the price per unit: Our service & advisory concept helps | MULTILAYER CIRCUITS MANUFACTURING | you to launch your product on the market "on the first hit". Technology Center "PP" (Pre Production): In our Computer Aided Product Engineering (CAPE) Department | MULTILAYER CIRCUITS MANUFACTURING | the boards are submitted to a comprehensive review with regard to a sustainable manufacturability by one of the latest computer front-end systems. Naturally any fault | MULTILAYER CIRCUITS MANUFACTURING | in design or mechanics and any potential modification to reduce costs or increase yield is passed through to the customer on a fast communication transfer. | MULTILAYER CIRCUITS MANUFACTURING | That´s our understanding of service commitment. DFM (Design For Manufacturing), FMEA (Failure Mode and Effects Analysis), CIP (Continuous Improvement Program) and SPC (Statistical Process Control) | MULTILAYER CIRCUITS MANUFACTURING | are applied depending on ...
[ Multilayer Circuits Manufacturing ]


... is considered. It is often worth purchasing “bare” chips and connecting them directly to the PCB with bonding wire. The amount saved on the | MULTILAYER CIRCUITS MANUFACTURING | chip casing could then pay off. | ERROR HIGHLIGHTS | > What are the most frequent mistakes or omissions? From the view of a pcb-manufacturer? | MULTILAYER CIRCUITS MANUFACTURING | (in order of the frequency) 1.) The indication, which drillings or milling should be plated through or not plated through. 2.) The dimensions on separately | MULTILAYER CIRCUITS MANUFACTURING | enclosed measure plans do not agree with the outline of the gerberdata. 3.) Data concerning the outer contour are missing. 4.) The aperturetable or the | MULTILAYER CIRCUITS MANUFACTURING | explanation of the symbolism of the aperturetable is missing. 5.) By production of printed circuit boards in a v- scored array sub panel are conductive | MULTILAYER CIRCUITS MANUFACTURING | strips or pads placed in such a way that the minimal edge distance of 0.5 mm is not considered. 6.) Exact tool-size`s for the drill-files | MULTILAYER CIRCUITS MANUFACTURING | are missing. 7.) The indication of slot-milling`s, wheather the dimension`s or the outline is to be ...
[ Multilayer Circuits Manufacturing ]


... Cost disadvantages of the immersion nickel / gold process could be balanced, in particular in the production of large series (consumer goods), if the | MULTILAYER CIRCUITS MANUFACTURING | use of chip-on-board is considered. It is often worth purchasing “bare” chips and connecting them directly to the PCB with bonding wire. The amount saved | MULTILAYER CIRCUITS MANUFACTURING | on the chip casing could then pay off. | ERROR HIGHLIGHTS | > What are the most frequent mistakes or omissions? From the view of | MULTILAYER CIRCUITS MANUFACTURING | a pcb-manufacturer? (in order of the frequency) 1.) The indication, which drillings or milling should be plated through or not plated through. 2.) The dimensions | MULTILAYER CIRCUITS MANUFACTURING | on separately enclosed measure plans do not agree with the outline of the gerberdata. 3.) Data concerning the outer contour are missing. 4.) The aperturetable | MULTILAYER CIRCUITS MANUFACTURING | or the explanation of the symbolism of the aperturetable is missing. 5.) By production of printed circuit boards in a v- scored array sub panel | MULTILAYER CIRCUITS MANUFACTURING | are conductive strips or pads placed in such a way that the minimal edge distance of 0.5 mm is not ...
[ Multilayer Circuits Manufacturing ]