Multilayer Circuit Boards Production The nominal distance between the centers of adjacent features on any single layer of a PCB.

... tests in the UL laboratories and they existed even the extremely heavy 130 C° long term test. That qualifies us without reservation for the | MULTILAYER CIRCUIT BOARDS PRODUCTION | US-American and Canadian safety standards. Down you see our "Yellow Card" shown with the valid parameters for a UL marking.     A (black triangle ) Symbol | MULTILAYER CIRCUIT BOARDS PRODUCTION | is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level requirements of UL 796. "All" | MULTILAYER CIRCUIT BOARDS PRODUCTION | is used to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level requirements of UL 796 | MULTILAYER CIRCUIT BOARDS PRODUCTION |     For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. Explanations concerning the UL certification Clad Cond Width | MULTILAYER CIRCUIT BOARDS PRODUCTION | Min The minimum conductor width is 150 µm, except the distance of the track to the outer contour is smaller than 400 µm. Clad Cond | MULTILAYER CIRCUIT BOARDS PRODUCTION | Width Min Edge If the distance between the track and ...
[ Multilayer Circuit Boards Production ]


... terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing them to liquid waves to achieve fusion. First, flux | MULTILAYER CIRCUIT BOARDS PRODUCTION | is applied to the board by dipping or brushing. Then the board is preheated in a liquid (maintained at 250 F). Next, the board is | MULTILAYER CIRCUIT BOARDS PRODUCTION | immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 F liquid to cool it and reduce thermal shock. | MULTILAYER CIRCUIT BOARDS PRODUCTION | Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and surface insulate those areas of a circuit where soldering | MULTILAYER CIRCUIT BOARDS PRODUCTION | is not desired. | STEP AND REPEAT | A method by which successive exposures of a single image are made to produce a Multiple Image | MULTILAYER CIRCUIT BOARDS PRODUCTION | Production Master. | SUB-PANEL | A group of printed circuits (called modules) arrayed in a panel and handled by both the board house and the | MULTILAYER CIRCUIT BOARDS PRODUCTION | assembly house as though it were a single printed wiring board. The sub-panel is usually prepared at the board house by routing most of the | MULTILAYER CIRCUIT BOARDS PRODUCTION | material separating ...
[ Multilayer Circuit Boards Production ]


... to shrink and I/O density mushrooms, the size and density of HDI microvias must follow suit. In 1997, for instance, the number of microvias | MULTILAYER CIRCUIT BOARDS PRODUCTION | on a typical PCB panel was about 20,000. Now, a typical HDI panel contains about 250,000 microvias.4 The combination of high demand, abbreviated product cycles, | MULTILAYER CIRCUIT BOARDS PRODUCTION | shrinking IC packaging, and soaring interconnect densities places a high value on the development of cost-effective, high-volume microvia formation processes. High-Volume Microvia Formation Methods There | MULTILAYER CIRCUIT BOARDS PRODUCTION | are four techniques most commonly used to generate microvias: mechanical drilling, laser drilling, plasma, and photo (liquid or film) formation. This article will concentrate on | MULTILAYER CIRCUIT BOARDS PRODUCTION | the first two techniques. The choice of which drilling technology to use depends upon material properties and desired hole diameter. Figure 3 is a synopsis | MULTILAYER CIRCUIT BOARDS PRODUCTION | of hole manufacturing technology capabilities. The most established microvia technology, mechanical drilling, has existed since the first generation of ...
[ Multilayer Circuit Boards Production ]