... that documents the fulfilment of the assured characteristics. - | WITH THE ELECTRICAL FINAL | inspection pcb´s are examined for short-circuit and interruption. The | MULTILAYER CIRCUIT BOARDS PRODUCE | test system is loaded with the gerber data which is provided to us from the client. From this gerber data a net list is generated, | MULTILAYER CIRCUIT BOARDS PRODUCE | i.e. all testpoints are determined. In accordance with this prepared test program the test-fixture-plates are drilled and equipped with test probes. The test probes led | MULTILAYER CIRCUIT BOARDS PRODUCE | by the test-fixture system are steered on the concerned contact points. The test sample is then set under current and the circuit is compared with | MULTILAYER CIRCUIT BOARDS PRODUCE | the data of the client. The system separates printed circuit boards, on which a short-circuit or an interruption was registered, from the error free examined | MULTILAYER CIRCUIT BOARDS PRODUCE | printed circuit boards. - | IN ORDER TO MAKE A COMPLETION | of the customer orders possible in due time, a Date- Pursuit-System is integrated | MULTILAYER CIRCUIT BOARDS PRODUCE | in the PPS. The daily received orders are in- rested individually into a ...
[ Multilayer Circuit Boards Produce ]


... — sponsored by The procurement of PCBs often leads to the question as to which surface protection is the right one. This is partly | MULTILAYER CIRCUIT BOARDS PRODUCE | due to the changing technical demands on PCBs in further processing. Also, as of 1. 6. 2006, EU-Regulations restricting the use of dangerous materials in | MULTILAYER CIRCUIT BOARDS PRODUCE | electronic appliances are to include the prohibition of materials containing lead, and is, therefore, another reason why alternative surfaces have been developed. One of these | MULTILAYER CIRCUIT BOARDS PRODUCE | is immersion tin. Procedure A layer of tin is applied to the PCB by means of a special process, in which the copper atoms of | MULTILAYER CIRCUIT BOARDS PRODUCE | the exposed conductors and contact areas are exchanged for tin atoms by adding thiourea. The chemical reaction ends when the copper surface is 0,6 to | MULTILAYER CIRCUIT BOARDS PRODUCE | 1,2 my. Between the tin and copper layers there is an inter-metallic copper-tin phase after this process, i.e. blended metal. There are a number of | MULTILAYER CIRCUIT BOARDS PRODUCE | reasons in favour of applying tin chemically. One advantage is the uniform smoothness of the surface. This ...
[ Multilayer Circuit Boards Produce ]


... the conductive pattern on printed circuits designed for the mounting or attachment of components. Also called Land. Lötauge Anderer Begriff für "Land". Anschlußfläche, vor | MULTILAYER CIRCUIT BOARDS PRODUCE | allem Begriff für Lötfläche in der SMD-Technik. Allgemein auch: Stellen auf der Leiterplatte, an denen Bauteile leitend mit dem Leiterbild verbunden werden. | PANEL | | MULTILAYER CIRCUIT BOARDS PRODUCE | Unit of Production of PCBs. Nutzen Fertigungsnutzen, ist meist eine rechteckige Basismaterialplatte, auf der meist mehrere Einheiten von Leiterplatten strukturiert und durchkontaktiert werden und am | MULTILAYER CIRCUIT BOARDS PRODUCE | Ende des Fertigungsprozesses vereinzelt werden. | PANEL PLATING | The plating of the entire surface of a panel (including holes). Flächengalvanisierung Die Aufmetallisierung eines Nutzen | MULTILAYER CIRCUIT BOARDS PRODUCE | ohne vorher erfolgte Fotostrukturierung des Leiterbildes, jedoch mit allen vorhandenen durchzukontaktierenden Bohrungen. | PATTERN | The configuration of conductive and non-conductive materials on a panel | MULTILAYER CIRCUIT BOARDS PRODUCE | or printed board. Also the circuit configuration on related ...
[ Multilayer Circuit Boards Produce ]