... to ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, to enable inspection of | MULTILAYER CIRCUIT BOARDS PLANT | panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not | MULTILAYER CIRCUIT BOARDS PLANT | required unless different to our standard of +0.1 / -0.05 mm. - Preferred with | OVERALL MECHANICAL DIMENSIONS | including notches, cutouts and slots. Also | MULTILAYER CIRCUIT BOARDS PLANT | preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / -0.25 mm. | | MULTILAYER CIRCUIT BOARDS PLANT | OTHER INFORMATION REQUIRED FOR ALL BOARDS INCLUDES: | board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) | MULTILAYER CIRCUIT BOARDS PLANT | solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production runs) | MULTILAYER CIRCUIT BOARDS PLANT | Extra information required for multilayers | ...
[ Multilayer Circuit Boards Plant ]


... OF PRINTED CIRCUIT BOARDS | | LAND | A portion of a conductive pattern usually, but not exclusively, used for the connection and / | MULTILAYER CIRCUIT BOARDS PLANT | or attachment of components. Also called Pad, Boss, Terminal Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole without a land(s). | | MULTILAYER CIRCUIT BOARDS PLANT | LASER VIAS | Are partial vias which are produced by a laser. They may connect two adjacent layers. Through-vias cannot be produced with this technique. | MULTILAYER CIRCUIT BOARDS PLANT | | LAYER-TO-LAYER SPACING | The thickness of dielectric material between adjacent layers of conductive circuitry. | LAY-UP | The technique of registering and stacking layers | MULTILAYER CIRCUIT BOARDS PLANT | of a multilayer board before the laminating cycle. | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, curtain coating, or spraying. | MULTILAYER CIRCUIT BOARDS PLANT | Afterwards, the laquer is cured sufficiently for the solder mask pattern to be photo-transferred to it before the unexposed parts are removed through a developing ...
[ Multilayer Circuit Boards Plant ]


... in the horizontal mode using specially designed horizontal processing equipment or in the vertical mode using a standard immersion type plating line. When choosing | MULTILAYER CIRCUIT BOARDS PLANT | a processing method, the following guidelines should be taken into consideration. Horizontal processing is recommended under the circumstances noted below. 1. Aspect ratios greater than | MULTILAYER CIRCUIT BOARDS PLANT | 5:1 2. Plated through-hole diameters smaller than 0.016 in (0.4 mm) 3. Blind vias 4. Thin, flexible materials If high aspect ratio and small holes | MULTILAYER CIRCUIT BOARDS PLANT | are processed in the vertical mode, vibration is recommended for each processing stage. The DMS-E process includes no cleaning sequence, therefore copper surfaces should be | MULTILAYER CIRCUIT BOARDS PLANT | clean and holes should be free of all drill debris. This may be achieved by chemical cleaning (e.g. ultrasonics) or by brushing with an ultrasonic | MULTILAYER CIRCUIT BOARDS PLANT | section to remove the drill debris prior to the DMS-E process. When processing double-sided panels through a horizontal line using sulfuric acid (e.g. Stabilizer) it | MULTILAYER CIRCUIT BOARDS PLANT | is ...
[ Multilayer Circuit Boards Plant ]