Multilayer Circuit Boards Industry Status-6 in our PCB or Printed Circuit Boards Production Specifications in DIN | in MIL | in IPC | In UL-Approval (File 96892).

... The chemical nickel-gold procedure (Imm NiAu) was unsuccessful due to high costs, as was chemical tin. Both procedures have proven to be very complicated | MULTILAYER CIRCUIT BOARDS INDUSTRY | and sensitive in the further course of processing management. Lead-free solderings also have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher | MULTILAYER CIRCUIT BOARDS INDUSTRY | processing temperatures and copper leaching effects. We would briefly like to explain why we believe chemical silver is the lead-free procedure of the future, and | MULTILAYER CIRCUIT BOARDS INDUSTRY | why it will be the focus of our future investments in the field of surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, | MULTILAYER CIRCUIT BOARDS INDUSTRY | it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of copper and the more “precious” silver. The advantages of this processing manner compared | MULTILAYER CIRCUIT BOARDS INDUSTRY | with chemical tin are fewer processing steps and lower rinsing temperatures (30 – 50 C°). From the printed circuit board manufacturer’s viewpoint, one ...
[ Multilayer Circuit Boards Industry ]


... areas are coated by a solder resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, | MULTILAYER CIRCUIT BOARDS INDUSTRY | or exposing them to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated | MULTILAYER CIRCUIT BOARDS INDUSTRY | in a liquid (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in | MULTILAYER CIRCUIT BOARDS INDUSTRY | another 250 F liquid to cool it and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask | MULTILAYER CIRCUIT BOARDS INDUSTRY | off and surface insulate those areas of a circuit where soldering is not desired. | STEP AND REPEAT | A method by which successive exposures | MULTILAYER CIRCUIT BOARDS INDUSTRY | of a single image are made to produce a Multiple Image Production Master. | SUB-PANEL | A group of printed circuits (called modules) arrayed in | MULTILAYER CIRCUIT BOARDS INDUSTRY | a panel and handled by both the board house and the assembly house as though it were a single printed wiring board. The sub-panel is | MULTILAYER CIRCUIT BOARDS INDUSTRY | usually prepared at the ...
[ Multilayer Circuit Boards Industry ]


... to rise the risk of delamination again. | FORMING MICROVIAS |. (Demand for small holes is ramping, with CO2 lasers leading the way) Thanks | MULTILAYER CIRCUIT BOARDS INDUSTRY | largely to the proliferation of smaller, more complex electronics devices such as cell phones, personal digital assistants, and notebook computers, the PCB industry is experiencing | MULTILAYER CIRCUIT BOARDS INDUSTRY | an overwhelming rise in demand for high-density interconnect structures (HDIS). The demand for HDIS translates directly into a vigorous market for the microvias used in | MULTILAYER CIRCUIT BOARDS INDUSTRY | many of these multilayer substrates as well as in conventional PCBs. In 1998, for example, the worldwide microvia market made up about four percent of | MULTILAYER CIRCUIT BOARDS INDUSTRY | the total multilayer PCB market. By 2007 that market share is expected to expand to nearly 30 percent (Figure 1). Figure 1. Estimates predict | | MULTILAYER CIRCUIT BOARDS INDUSTRY | MICROVIA BOARDS | will comprise 29 percent of all buildup boards by 2007. Worldwide, the | TOTAL MICROVIA | market approached $4 billion in 2000 | MULTILAYER CIRCUIT BOARDS INDUSTRY | - up 63 percent over 1999 (Figure 2).1 By the end of 2001 the ...
[ Multilayer Circuit Boards Industry ]