... and services: - Constant optimization our our quality management and quality assuring system. To improve the sense of responsibility and the ability ta act | MULTILAYER CIRCUIT BOARDS FAB | on its own according to our quality standards. - Reduction of the production costs by promoting a preventive quality management system and by improving the | MULTILAYER CIRCUIT BOARDS FAB | controling measures that rule production and business processes. - Superiority to the products of our competitors by guaranteiing the customer'requirements even under extreme conditions. - | MULTILAYER CIRCUIT BOARDS FAB | Superiority to the competitors in advisory services and precise delivery on time. | FOR THE CONVERSION OF THIS QUALITY TERM WE SEIZED THE FOLLOWING MEASURES | MULTILAYER CIRCUIT BOARDS FAB | IN FOUR STRATEGIC SEGMENTS: | - Structure of optimally functioning interface transitions between our company and our customers. - Accessibility for the customer between 8 | MULTILAYER CIRCUIT BOARDS FAB | to 20 o'clock. - Consultation of the customer during the definition of its product specifications with the goal of providing him a qualitatively high-quality product ...
[ Multilayer Circuit Boards Fab ]


... 4.1 Quality Standards All boards are produced according to the following standards: PERFAG 1 C PERFAG 2 E PERFAG 3 C IPC-A-600 E IPC-SM-840 | MULTILAYER CIRCUIT BOARDS FAB | B IPC-R-700 C 4.2 Quality procedures Microcirtec follows the standards of DIN/ISO 9002. Production parameters, conditions of production and raw materials are evaluated and registered | MULTILAYER CIRCUIT BOARDS FAB | by the use of calibrated measuring equipment. non-destructive testing Automatic and optical inspection routines follow the guidelines of IPC-A 600, class 2. Specific inspection procedures | MULTILAYER CIRCUIT BOARDS FAB | can be adapted to other specifications on demand. destructive testing Micro section to accertain plating precipitation and surface protection thickness plating adhesion tests Multilayer boards | MULTILAYER CIRCUIT BOARDS FAB | are submitted to regular and steady thermal shock tests Documentation of parameters * Production parameters * time-stamps, involved staff members * and quality linked results | MULTILAYER CIRCUIT BOARDS FAB | are automatically documented and electronically recorded in archives for at least 3 years. 4.3 Electrical testing The ...
[ Multilayer Circuit Boards Fab ]


... to separate a layer of material from its base. This may be measured as peel strength, in pounds per inch of width, or as | MULTILAYER CIRCUIT BOARDS FAB | pull strength, in pounds per square inch (when a perpendicular pull is applied to the surface of the material). Frequently used to refer to wire | MULTILAYER CIRCUIT BOARDS FAB | bonds. | BREAKAWAY PANELS | Hardboards held together in a grouping with breakaway tabs. The panels make handling easier for automatic insertion and wave soldering. | MULTILAYER CIRCUIT BOARDS FAB | The boards can be separated by snapping apart. | BREAKDOWN VOLTAGE | The voltage at which an insulator or dielectric ruptures, or at which ionization | MULTILAYER CIRCUIT BOARDS FAB | and conduction take place in a gas or vapor. | BRIDGING ELECTRICAL | The formation of a conductive path between conductors. | B-STAGE | The | MULTILAYER CIRCUIT BOARDS FAB | condition of a resin polymer when it is more viscous, with higher molecular weight, and insoluble but plastic and fusible. Semi-cured. | B-STAGE MATERIAL | | MULTILAYER CIRCUIT BOARDS FAB | Sheet material impregnated with a resin cured to an intermediate stage. Prepreg is the preferred term. | B-STAGE RESIN | ...
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