... rough edges. Special attention was given to environmental compatibility and safety conditions. Furthermore, the facility was designed to accommodate future expansions. The requirements were | MULTILAYER CIRCUIT BOARDS | as follows: - LP formats: Up to 640 x 610 mm - LP thickness: 0.30 – 10.0 mm - Materials: FR- 4, BT-epoxy, polyimide, “Thermount”/RCF | MULTILAYER CIRCUIT BOARDS | - Heat ramp rates: 5-6°C/min. (measured as a package) Great emphasis was put on automation for stacking and for enclosed separation sheet circulation. The flow | MULTILAYER CIRCUIT BOARDS | directions for the transport sheets and separation sheets are intentionally interrupted after de-stacking, enabling cleaning of sheets or buffering of empty stacks. With the aid | MULTILAYER CIRCUIT BOARDS | of vacuum, a lot less pressure is required, resulting in less distortions and virtually no air entrapment. Another plus is that very little resin flows | MULTILAYER CIRCUIT BOARDS | from the multilayer. The finished result is a board with lower dielectric constant, preferred for impedance controlled boards which are becoming very dominant in todays | MULTILAYER CIRCUIT BOARDS | market. ...
[ Multilayer Circuit Boards ]


... OR VIAS | A plated-thru hole in a Printed Circuit Board that is used to provide electrical connection between a trace on one side | MULTILAYER CIRCUIT BOARDS | of the Printed Circuit Board to a trace on the other side. Since it is not used to mount component leads, it is generally a | MULTILAYER CIRCUIT BOARDS | small hole and pad diameter. | FIDUCIAL OPTICAL TARGET |. Also called OS. | FINAL COPPER THICKNESS | The copper thickness stated in the PCB | MULTILAYER CIRCUIT BOARDS | specification. This thickness is to be understood as the total thickness of copper foil + copper plating. Fine-pitch SMD component with center-to-center terminal distances of | MULTILAYER CIRCUIT BOARDS | less than 0,635 mm. Fluxing The process of removing oxides from a PCB to prepare it for soldering. Fluxing lowers the surface tension of the | MULTILAYER CIRCUIT BOARDS | solder and helps promote the formation of good solder fillets. Foil A thin continuous sheet of metal, usually copper or aluminum, used as the conductor | MULTILAYER CIRCUIT BOARDS | for printed circuits. Foils used for printed circuits are commonly 1 or 2 ounces per square foot the thinner the foil, the lower ...
[ Multilayer Circuit Boards ]


... contain the following information to ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, | MULTILAYER CIRCUIT BOARDS | to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each | MULTILAYER CIRCUIT BOARDS | size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and | MULTILAYER CIRCUIT BOARDS | slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / -0.25 | MULTILAYER CIRCUIT BOARDS | mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) | MULTILAYER CIRCUIT BOARDS | solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production runs) | MULTILAYER CIRCUIT BOARDS | Extra information ...
[ Multilayer Circuit Boards ]