Multilayer Boards Technologies Printed Circuit Boards with Buried Vias | Blind Vias | Embedded Passive Components | Impedance Control.

... BOARDS | Gel Time The time, expressed in seconds, required for a resin to change from a solid to a liquid and back to | MULTILAYER BOARDS TECHNOLOGIES | a solid again, due to the action of thermal input. | GLASS EPOXY |A material used to fabricate Printed Circuit Boards. The base material (fiberglass) | MULTILAYER BOARDS TECHNOLOGIES | is impregnated with epoxy filler which then must have copper laminated to its outer surface to form the material required to manufacture Printed Circuit Boards. | MULTILAYER BOARDS TECHNOLOGIES | | GOLDEN BOARD | A PCB previously found to be correct, used as a reference in comparative testing methods. | GRID A TWO-DIMENSIONAL | network | MULTILAYER BOARDS TECHNOLOGIES | consisting of a set of equally spaced parallel lines superimposed upon another set of equally spaced parallel lines so that the lines of one set | MULTILAYER BOARDS TECHNOLOGIES | are perpendicular to the lines of the other. | GROUND PLANE | A conducting surface, used as a common reference point for circuit returns shielding | MULTILAYER BOARDS TECHNOLOGIES | or heat ...
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... TERMINOLOGY AND TERMS OF PRINTED CIRCUIT BOARDS | | REFLOWING | The melting of an electrodeposit followed by solidification. The surface has the appearance | MULTILAYER BOARDS TECHNOLOGIES | and physical characteristics of being hot dipped. | REGISTRATION | The degree of conformity of the position of a pattern, or a portion thereof, with | MULTILAYER BOARDS TECHNOLOGIES | its intended position or with that of any other conductor layer of a board. | RESIN EPOXY-MATERIAL | used for impregnating glass weave. | RESIN | MULTILAYER BOARDS TECHNOLOGIES | | Recession The presence of voids between the barrel of the plated-through hole and the wall of the hole, seen in microsections of plated-through holes | MULTILAYER BOARDS TECHNOLOGIES | in boards exposed to high temperatures. | RESIN SMEAR | Resin transferred from the base material onto the surface or edge of the conductive pattern | MULTILAYER BOARDS TECHNOLOGIES | normally caused by drilling. Sometimes called Epoxy Smear. | RESIST COATING MATERIAL | used to mask or to protect selected areas of a pattern from | MULTILAYER BOARDS TECHNOLOGIES | the action of an etchant solder, or plating. | RING VOIDS | The absence of substance in a localized ...
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... Mechanical drilling is an effective method for hole diameters larger than 0.010" (250 microns). Below 0.010", however, operational costs rise exponentially. For example, a | MULTILAYER BOARDS TECHNOLOGIES | manufacturer might get 5,000 hits per drill bit when forming 0.008" or 0.010" vias but only 1,000 hits per bit for 0.006" vias. However, recent | MULTILAYER BOARDS TECHNOLOGIES | advances in mechanical drilling technology such as high-speed spindles (Figure 4a and 4b) have increased drill bit life two to three times over previous generations | MULTILAYER BOARDS TECHNOLOGIES | of mechanical drills. And since the PCBs can be stacked, it is possible for mechanical drills to be similar to laser drills in productivity. The | MULTILAYER BOARDS TECHNOLOGIES | minimum hole size economically manufactured by mechanical drills currently seems to be 0.006". To drill holes smaller than 0.006" would require alternate hole formation technology. | MULTILAYER BOARDS TECHNOLOGIES | There are current R&D efforts to drill holes of 0.002" to 0.003" in diameter. Diameter, however, is not the only limitation: With accuracies of +/-0.002", | MULTILAYER BOARDS TECHNOLOGIES | conventional mechanical ...
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