... dielectric to the copper layer below where the dielectric is cleanly removed from the copper without damaging it. This two-step process can be extended, | MULTILAYER BOARDS PRODUCTION | of course, to include more than two layers. In this case, laser fluence would be automatically modulated higher for each copper layer encountered and lower | MULTILAYER BOARDS PRODUCTION | for each dielectric layer. A CO2 laser can be used along with the UV DPSS in a dual-laser setup that combines the ablation speed of | MULTILAYER BOARDS PRODUCTION | CO2 on dielectric materials with the ability of UV DPSS to ablate copper. This procedure obviates the need for precise fluence control of a single | MULTILAYER BOARDS PRODUCTION | UV DPSS laser and capitalizes on the selective ablation thresholds of different materials at different wavelengths. The dual-laser approach therefore boosts panel throughput by exploiting | MULTILAYER BOARDS PRODUCTION | the advantages of both lasers and circumventing their limitations. Moreover, the dual-laser technique, like the other laser processes, requires only a single panel run to | MULTILAYER BOARDS PRODUCTION | complete all steps of microvia formation. The ...
[ Multilayer Boards Production ]


... Panel-Size-Optimization would like to assist you at finding the best shapes, dimensions and the best separation process for your PCB`s! Get in contact! | | MULTILAYER BOARDS PRODUCTION | JUST TEST US | One important process in offering you a very low price is an efficient use of the given spaec on our production | MULTILAYER BOARDS PRODUCTION | panel. Especially in times of raising prices in the laminate sector, the question how to arrange your PCB`s on our production panel is getting more | MULTILAYER BOARDS PRODUCTION | and more essential. Therefore the size, shape and the width of the dummy areas of your pcb can have an important influence on the price-building | MULTILAYER BOARDS PRODUCTION | process. In each case - unfunctional "extravagancy" or dummy areas, dominated by vast registration holes - we will contact you to minimize unnecessary costs. | | MULTILAYER BOARDS PRODUCTION | V-CUTTING | The V-cutting process is the most space-saving mechanical separation process. As pcb`s can be arranged on the panel one by one in "zero-spaces", | MULTILAYER BOARDS PRODUCTION | this process helps to save you money at high-volume orders. (more than 1000 Eurocards). One disadvantage ...
[ Multilayer Boards Production ]


... 2000 mm +/- 0,50 mm +/- 1,20 mm 5.10 Routing As a result of the given Coefficient of Thermal Expansion (CTE) of the base | MULTILAYER BOARDS PRODUCTION | material a certain offset from the PTH-drill to the NPTH-drill or routing is inevitably, since the material has been exposed several times to thermal procedures | MULTILAYER BOARDS PRODUCTION | like solder mask burn in, HAL etc. Standard µ Special µ Technical limit µ Offset PTH-drill to contouring* +/- 200 +/- 150 +/- 100 Offset | MULTILAYER BOARDS PRODUCTION | layout to contouring +/- 200 +/- 150 +/- 100 5.11 V- cutting (scoring) Regarding V-cutting the same dimension tolerances are to be considered as for | MULTILAYER BOARDS PRODUCTION | routing. Please pay attention to the fact that a certain circuit-free space depending on material thickness must be available around the outlines. E.g. using material | MULTILAYER BOARDS PRODUCTION | of 1,5 mm thickness by considering a dimension tolerance of +/- 0,2 mm tracks/pads etc. must have a spacing around the outlines of 0,40 mm. | MULTILAYER BOARDS PRODUCTION | If the dimension tolerance is required to be without plus values the applied minus tolerance has to be added to the ...
[ Multilayer Boards Production ]