... products and services. On the company`s plant of 25.000 sqm we are able to produce 3.000 sqm of single-sided, 8000 sqm double- sided PCBs | MULTILAYER BOARDS PLANT | and 10.000 sqm Multilayer per month. Product Informations -- Interconnect Carriers -- | Boards | Circuits | PCBs | PWBs | PCB Carriers | Circuit Boards | MULTILAYER BOARDS PLANT | | Printed Wiring Boards | Printed Circuit Boards | Rigid Boards | Circuit Cards | Printed Circuits | | Single Sided | Double Sided | | MULTILAYER BOARDS PLANT | Plated Through Hole | Multilayer Boards up to 12 Layers | | HDI (high density) Boards | | Buried Vias | Blind Vias | Embedded | MULTILAYER BOARDS PLANT | components | In Fine-Line | in Micro-Fine-Line | in HDI-Technologie | Microvias in Laser- Technology SBU| | From Medium to High Volume | | Specifications | MULTILAYER BOARDS PLANT | in DIN | in MIL | in IPC | in UL-Approval (File 96892) | | Hot Air Leveling (HAL – also lead free) = Circuitry | MULTILAYER BOARDS PLANT | in bare copper with LPI Solder Mask | | Gold Fingers-, Tabs-, or Body Plating | Nickel & Immersion Gold (NiPAu) | | Immersion Tin | MULTILAYER BOARDS PLANT | Protection | OSP Organic Surface Protection | ...
[ Multilayer Boards Plant ]


... for cool down and availability to the imaging operation. Image LPI Mask Dried solder mask is imaged in a manner similar to that used | MULTILAYER BOARDS PLANT | for imaging the circuitry. Phototools containing black areas where the solder mask is to be removed are placed in direct contact with both sides of | MULTILAYER BOARDS PLANT | the panel. The panel is then exposed to UV light. The amount of light used is controlled by an integrator. Printing is done with a | MULTILAYER BOARDS PLANT | semi-automatic dual drawer printer. While one drawer is being loaded with a panel and phototools, the other is inside the machine being exposed. This dual | MULTILAYER BOARDS PLANT | drawer printing system runs at the same rate as the screen printer to insure continuous flow. Develop LPI Mask After the panel has been exposed, | MULTILAYER BOARDS PLANT | it is placed in a vertical developer. The unexposed solder mask is dissolved in a high pressure spray of developing solution. The solution temperature, concentration | MULTILAYER BOARDS PLANT | and conveyor speed control the development process. The developer solution concentration is maintained by a ...
[ Multilayer Boards Plant ]


... connecting inner layers of multilayer board, that penetrates to one Outer-Layer. | BLISTER | A localized swelling and separation between any of the layers | MULTILAYER BOARDS PLANT | of a laminated base material, or between base material and conductive foil. It is a form of delamination. | BOND STRENGTH | A measure of | MULTILAYER BOARDS PLANT | force or pressure required to separate a layer of material from its base. This may be measured as peel strength, in pounds per inch of | MULTILAYER BOARDS PLANT | width, or as pull strength, in pounds per square inch (when a perpendicular pull is applied to the surface of the material). Frequently used to | MULTILAYER BOARDS PLANT | refer to wire bonds. | BREAKAWAY PANELS | Hardboards held together in a grouping with breakaway tabs. The panels make handling easier for automatic insertion | MULTILAYER BOARDS PLANT | and wave soldering. The boards can be separated by snapping apart. | BREAKDOWN VOLTAGE | The voltage at which an insulator or dielectric ruptures, or | MULTILAYER BOARDS PLANT | at which ionization and conduction take place in a gas or vapor. | BRIDGING ELECTRICAL | The formation of a ...
[ Multilayer Boards Plant ]