... THERMAL RELIEFS |are surrounded by voids in the ground (clearances) and the clearances lack sufficient annular rings to ensure connections, the clearances must be | MULTILAYER BOARDS MANUFACTURING | enlarged to meet manufacturing capabilities, thus causing the thermal to be isolated from the rest of the ground plane. This may be the case with | MULTILAYER BOARDS MANUFACTURING | internal layer files, but the external files can show the same data, such as the surface mount component's length and width. The operator must determine | MULTILAYER BOARDS MANUFACTURING | whether the aperture wheel calls out X first and Y second or Y first and X second. The wrong choice may cause the surface mount | MULTILAYER BOARDS MANUFACTURING | land to short into another feature or become oversized or undersized. A mistype of a circle instead of a square may deprive the SM component | MULTILAYER BOARDS MANUFACTURING | of a land that is sufficient to ensure the component is level during wave soldering. When typed incorrectly, soldermask clearance sizes can result in mask | MULTILAYER BOARDS MANUFACTURING | on lands or enlarged clearances that expose traces. Open Road: When asking a fabricator to manually manipulate ...
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... processing slit. The process of solder mask coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match the gold plating. | MULTILAYER BOARDS MANUFACTURING | To prevent the risk of poor metallic deposition on the gold surface, vias must be completely free of solder mask coating or be completely closed by | MULTILAYER BOARDS MANUFACTURING | means of a special filling process. Curing of the solder mask coating must also concur with that of the chemical gold plating as it is | MULTILAYER BOARDS MANUFACTURING | exposed to hydrogen in the 90° C nickel baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, in | MULTILAYER BOARDS MANUFACTURING | turn, also calls for further investment in facilities. THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel | MULTILAYER BOARDS MANUFACTURING | gold coating, the results of wave soldering are equally good to solder levelling. Good storage ability is also achieved by covering the pad and smd | MULTILAYER BOARDS MANUFACTURING | sides with gold. In our opinion, however, immersion nickel / gold will never become ...
[ Multilayer Boards Manufacturing ]


... CIRCUIT BOARDS | Since year 2000 we transform our production processes step by step to the requirements of the RoHS compliances. This transition is | MULTILAYER BOARDS MANUFACTURING | now completed and covers the necessary changes concerning base material, PCB design and the supply chain up to the product ready for use. Since 2004 | MULTILAYER BOARDS MANUFACTURING | we deliver our customers with RoHS compliant PCBs in different surface finishes – including also lead free Hot-Air-Levelling, Immersion Tin, Immersion Silver and Immersion Gold. | MULTILAYER BOARDS MANUFACTURING | More | UL-APPROVAL | The letters UL stand for Underwriters Laboratories Inc., this organization is an independent, not-for-profit product-safety testing and certification organization. | IN | MULTILAYER BOARDS MANUFACTURING | THE BEGINNINGS OF UL | more than 100 years ago stood questions in the range of fire-protection-mechanisms in the foreground. Today all possible products, materials, | MULTILAYER BOARDS MANUFACTURING | constructions and systems are tested and evaluated regarding their electrical danger as well as their danger of accident and fire. And in addition there were ...
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