... in questions of the product liability and brings a higher acknowledgment at authorities. In order to guarantee the adherence to the examined values, a | MULTILAYER BOARDS | Follow UP service is furnished. An expert from UL visits regularly our manufacturing areas and controls ranges of our production. In addition we are obligated | MULTILAYER BOARDS | to submit in certain distances printed circuit boards in the listed remarks to UL for examination. This offers additional security and reliability. You increase your | MULTILAYER BOARDS | export chances in the USA and Canada, if the printed circuit boards of your products are UL marked. UL stands for "Underwriter Laboratories" Inc., a | MULTILAYER BOARDS | "non-profit organization", which examines electronic devices and components for the adherence to American safety standards. Also our printed circuit boards were subjected to the hardest | MULTILAYER BOARDS | tests in the UL laboratories and they existed even the extremely heavy 130 C° long term test. That qualifies us without reservation for the US-American | MULTILAYER BOARDS | and Canadian safety ...
[ Multilayer Boards ]


... otherwise stipulated, the PCB contour will be determined by the centre (=centre vector) of the contour lines provided in the order data. If Slots | MULTILAYER BOARDS | are represented by you by rectangular outlines, then we assume generally that the corner radius is contained. | 13. TECHNICAL SPECIFICATIONS | PRINTED CIRCUIT BOARDS | MULTILAYER BOARDS | | 13.1 For further technical specifications of our manufacturing processes, please refer to our Process & Capability Manual in the "Standard" category. These standard technical | MULTILAYER BOARDS | criteria also apply even if your manufacturing data and documents call for other features (special technical requirements are available in our Premium Jet Line). | | MULTILAYER BOARDS | 14. UL CERTIFICATION | 14.1 If the PCB is to be produced in line with our UL Certification, please follow the layout instructions.. | 15. | MULTILAYER BOARDS | INNERLAYERS | 15.1 The minimum spacing of not plated through holes/plated through holes not surrounded by a pad to innerlayer copper must be at least | MULTILAYER BOARDS | 400 µ. The minimum spacing of the innerlayer copper to ...
[ Multilayer Boards ]


... chemical silver refinement uncomplicated and reliable, but once the manufacturing parameters have been set they can be dependably utilised for further processing and continued | MULTILAYER BOARDS | use. Due to the thin surface layer – a thickness of 0.15 – 0.3 mµ is recommended – the surface of the pad is smoother | MULTILAYER BOARDS | and therefore there are, even in fine pitch areas, no restrictions when assembling. The silver functions merely as a protection against oxidation, and the actual | MULTILAYER BOARDS | solder point is between the copper and chemical tin, therefore the solder point is absolutely stable. It fulfills all UL requirements (UL796 specif.) and meets | MULTILAYER BOARDS | the usual requirements of automobile manufacturers: Test results Test AlphaSTAR Result Requirement SIR 85°C/85%RH 2.46+9 24h Passed >1E+8; IPC- 4553 IPC-TM-650 2.6.3.5 3.15E+9 96h Passed | MULTILAYER BOARDS | SIR 35°C/85%RH 100VDC 3.56E+11 24h Passed >1E+10; IPC-4553 and GR 78 (Bellcore) IPC-TM-650 2.6.3.5 4.62E+11 96h passed EM 10V bias, 100V Test 2.46E+9 24h initial | MULTILAYER BOARDS | Resistance no higher than the ...
[ Multilayer Boards ]