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... and crash photoplotters. After the basic prep work is completed, step into the fabrication | PRINTED CIRCUIT BOARDS | analysis arena, where the game | CIRCUIT BOARDS SUPPLIERS | is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and balances can resolve any conflicts between the two. | | CIRCUIT BOARDS SUPPLIERS | TAKE SOLDERMASK LAYERS |, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that is, there is not much in the | CIRCUIT BOARDS SUPPLIERS | way of capability checking within the tool. As a result, these are among the more troublesome layers for fabricators. The solution here is a fabrication | CIRCUIT BOARDS SUPPLIERS | analysis tool that can handle such issues as clearances, coverage, webbing, and so forth. For instance, most fab shops want the largest possible | CLEARANCES | CIRCUIT BOARDS SUPPLIERS | | in a solder layer so that mask doesn't end up on pads. On the flip side, copper is not supposed to be exposed. The | CIRCUIT BOARDS SUPPLIERS | two requirements - no mask on pads and unwanted exposed copper - must be balanced. It is not easy to do. How can the ...
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... parts. | THIXOTROPY: |Property of a material to reduce its viscosity under mechanical influence / shearing stress by means of pumping, stirring, squeegee pressure | CIRCUIT BOARDS SUPPLIERS | and to return to its original conditions after the stress has finished. Screen- printing inks, for instance, have a very high thixotropy. On account of | CIRCUIT BOARDS SUPPLIERS | the squeegee pressure and the movement the screen-printing ink becomes thinner and thus flows through the screen meshes onto the substrate to be coated. After | CIRCUIT BOARDS SUPPLIERS | lifting-off of the screen/stencil the ink must "stand"; it has to achieve its original condition rapidly and must not flow anymore, which ensures a good | CIRCUIT BOARDS SUPPLIERS | edge coverage. | TRACK / GAP: | Technical expression describing the minimum of conductor width (track or trace)  and the minimum Insulation width (gap) between | CIRCUIT BOARDS SUPPLIERS | two of them on a printed circuit board. Track/gap helps to define the degree of difficulty in the production of pcb`s. Track/gap is mostly measured | CIRCUIT BOARDS SUPPLIERS | in micron or in mil. | THROUGH CONNECTION | An electrical ...
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... CIRCUIT BOARDS | | LAND | A portion of a conductive pattern usually, but not exclusively, used for the connection and / or attachment | CIRCUIT BOARDS SUPPLIERS | of components. Also called Pad, Boss, Terminal Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole without a land(s). | LASER VIAS | CIRCUIT BOARDS SUPPLIERS | | Are partial vias which are produced by a laser. They may connect two adjacent layers. Through-vias cannot be produced with this technique. | LAYER-TO-LAYER | CIRCUIT BOARDS SUPPLIERS | SPACING | The thickness of dielectric material between adjacent layers of conductive circuitry. | LAY-UP | The technique of registering and stacking layers of a | CIRCUIT BOARDS SUPPLIERS | multilayer board before the laminating cycle. | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, curtain coating, or spraying. Afterwards, the | CIRCUIT BOARDS SUPPLIERS | laquer is cured sufficiently for the solder mask pattern to be photo-transferred to it before the unexposed parts are removed through a developing ...
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