Circuit Boards A-Z based Custom Maufacture of Commercial and Military Grade Interconnect Carriers | SS-, Ds-, PTH-, Flex-PCBs, High count Multilayer and HDI-Technology. We guarantee you delivery on time as rapid mass production and best pricing

... CIRCUIT BOARDS | Gel Time The time, expressed in seconds, required for a resin to change from a solid to a liquid and back | CIRCUIT BOARDS | to a solid again, due to the action of thermal input. | GLASS EPOXY |A material used to fabricate Printed Circuit Boards. The base material | CIRCUIT BOARDS | (fiberglass) is impregnated with epoxy filler which then must have copper laminated to its outer surface to form the material required to manufacture Printed Circuit | CIRCUIT BOARDS | Boards. | GOLDEN BOARD | A PCB previously found to be correct, used as a reference in comparative testing methods. | GRID A TWO-DIMENSIONAL | | CIRCUIT BOARDS | network consisting of a set of equally spaced parallel lines superimposed upon another set of equally spaced parallel lines so that the lines of one | CIRCUIT BOARDS | set are perpendicular to the lines of the other. | GROUND PLANE | A conducting surface, used as a common reference point for circuit returns | CIRCUIT BOARDS | shielding or heat ...
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... information to ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, to enable inspection | CIRCUIT BOARDS | of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are | CIRCUIT BOARDS | not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and slots. Also preferred | CIRCUIT BOARDS | is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / -0.25 mm. Other information | CIRCUIT BOARDS | required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type | CIRCUIT BOARDS | (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production runs) Extra information required | CIRCUIT BOARDS | for multilayers ...
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... BOARDS | Features/Benefits Selective to Dielectric and Glass Total Process Cost Reduction Environmentally Sound Excellent Copper-to-Copper Adhesion and Through-Hole Coverage Horizontal and Vertical Process | CIRCUIT BOARDS | Compatibility No Hole Size, MLB Layer Count or Aspect Ratio Limitations Suitable for PTH Innerlayer or Microvia Metallization CHARACTERISTICS: - excellent copper to copper adhesion | CIRCUIT BOARDS | - no additional etching will be necessary for copper-cleaning - no residuals in blind-micro-Via´s The DMS-E direct metallization system selectively deposits highly conductive polymer on | CIRCUIT BOARDS | dielectric resin and glass areas without the use of electroless copper. The formaldehyde-free, environmentally sound technology provides fast and uniform coverage of the plated through-hole. | CIRCUIT BOARDS | DMS-E selective catalyzation ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. Innerlayer and outerlayer copper surfaces remain pristine, eliminating the potential for interconnect | CIRCUIT BOARDS | defects and ...
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